Optical module and lead frame for optical module

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

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Details

257 99, 257100, 257432, 257433, 257448, 257459, 257676, 257724, 257787, H01L 2715, H01L 3112, H01L 3300, H01L 310232, H01L 23495

Patent

active

061570508

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to an optical module and a lead frame for the optical module; and, in particular, to an optical module mounting a plurality of optical devices and a plurality of semiconductor circuit devices on the same lead frame, and the lead frame for the optical module.


BACKGROUND ART

Attempts have conventionally been made to attain the higher packing density of parts using a lead frame. As an example of such attempts, there is a technique disclosed in Japanese Patent Application Laid-Open No.1-257361. FIG. 15 is a sectional view of the semiconductor assembly disclosed in the above-mentioned publication. Referring to FIG. 15, semiconductor elements 404, 404' are mounted on the surfaces of two lead frames 401, 401', respectively. Electrode pads on the individual semiconductor elements 404, 404' are connected to their corresponding inner leads by bonding wires 403, 403', respectively. Then, with their rear faces faced to each other, the two lead frames 401, 401' are overlaid on each other with an insulating film 405 interposed therebetween. Subsequently, the semiconductor elements 404, 404' are encapsulated with an encapsulating resin body 402. Thereafter, the outer lead pins of the two lead frames are bent in one direction. Since the outer lead pins of the two respective lead frames are bent with their different lengths, they would not come into contact with each other.


DISCLOSURE OF INVENTION

In the semiconductor assembly having such a configuration, an electric connection between the two lead frames is made via an outer lead. Additional outer lead pins are required for connecting the respective semiconductor elements mounted on the different lead frames to each other, whereby the number of the outer lead pins cannot be reduced even when this configuration is employed. It cannot improve the packing density of the semiconductor assembly.
If such a configuration is applied to an optical module such that a transmitting unit and a receiving unit are mounted on the two lead frames, respectively, and are integrally encapsulated with resin, then the signal light emitting and receiving faces of the transmitting and receiving units are located back to back, whereby their optical couplings cannot be made in the same direction.
On the other hand, in a module in which a light-receiving element or light-emitting element and a circuit element are mounted to a single lead frame, the light-receiving element and a preamplifier have been separately encapsulated with resin to make a light-receiving module, or the light-emitting element and its driver IC have been separately encapsulated with resin to make a light-emitting module. In order to make a transmitter/receiver module, it is necessary to assemble a module for a receiving portion and a module for a transmitting portion, so as to produce the transmitter/receiver module. As the distance between the light-emitting element and the light-receiving element becomes shorter, the circuit element portion must be made smaller depending on this distance, whereby it is hard to secure an area for mounting the circuit elements.
When a main amplifier, a clock data reproducing circuit, and the like, in addition to the preamplifier, are mounted to the circuit element mounting portion, the mounting area for such additional circuit devices cannot be secured.
Therefore, it is an object of the present invention to provide an optical module, having a plurality of optical semiconductor devices and a plurality of circuit devices with their emitting and receiving faces faced to one direction, which is suitable for a smaller size and a higher density; and a lead frame for the optical module.
The present invention is configured as follows.
The optical module in accordance with the present invention comprises an optical device which is one of a semiconductor light-receiving device and a semiconductor light-emitting device, a semiconductor circuit device, a lead frame, and a first encapsulating resin body. The semiconductor light-receiving device is provide

REFERENCES:
patent: 5587605 (1996-12-01), Ramsey et al.
patent: 5668383 (1997-09-01), Krieger

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