Optical module

Coherent light generators – Particular active media – Semiconductor

Reexamination Certificate

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Details

C372S043010, C372S036000, C372S034000

Reexamination Certificate

active

06212212

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to an optical module mounting an optical device, such as a semiconductor laser diode or a photodiode.
BACKGROUND OF THE INVENTION
An optical module, which optically couples an optical transmission line, such as an optical fiber, with an optical device, such as a semiconductor laser (LD, hereinafter) or a photodiode (PD, hereinafter), plays an important role in constructing an optical communication system.
In a method for mounting an optical device on a substrate, the optical device is mounted on a Si substrate in most cases. For example, such an optical module is reported by K. Kurata and others in a paper “A surface mount type optical module for subscriber network”, Proceeding of the 1995 Electronics Society Conference of IEICE, SC-1-12.
In the optical device mounted on the substrate by soldering, an internal stress remains behind in the active layer or the photoabsorption layer of the soldered optical device, because of the difference in the thermal expansion coefficients between the optical device and the substrate, hence the optical device is short-lived and reliability of the optical module deteriorates. Especially, in an array optical device of multi-channels, since the amount of thermal contraction of the optical devices is larger than that in the optical device of single channel, there has been further apprehension for deterioration of reliability.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the invention to provide an optical module, which is highly reliable and contributes for integration and miniaturization of an optical circuit by decreasing an internal stress in an active layer or a phtoabsurption layer of an optical device.
According to the feature of the invention, an optical module comprises:
an optical device provided with a first electrode formed on a bottom surface thereof,
a substrate provided with a second electrode formed on a top surface thereof,
a solder layer region for joining the first and second electrodes, and
a cavity region formed directly under the optical device in the solder layer region.


REFERENCES:
patent: 5796714 (1998-08-01), Chino et al.
patent: 5835650 (1998-11-01), Kitaoka et al.
patent: 6069904 (2000-05-01), Kitaoka et al.
patent: 6088378 (2000-07-01), Furukawa
patent: 8-306844 (1996-11-01), None
patent: 9-64479 (1997-03-01), None
“A Surface Mount Type Optical Module for Subscriber Networks”Electronics Society Conference of IEICE, sc-1-12, 1995, pp. 331-332.

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