Optical modulator module package structure

Optical: systems and elements – Optical modulator – Light wave temporal modulation

Reexamination Certificate

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C359S245000, C359S254000, C359S263000, C359S295000, C359S298000, C359S318000, C359S562000, C359S572000, C359S573000, C359S574000, C257S081000, C257S084000, C257S099000, C257S433000, C257S437000, C257S602000, C257S678000, C257S720000, C257S730000, C257S778000

Reexamination Certificate

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07319553

ABSTRACT:
Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.

REFERENCES:
patent: 5311360 (1994-05-01), Bloom et al.
patent: 6558976 (2003-05-01), Shrauger
patent: 7116456 (2006-10-01), Hwang et al.
patent: 2006/0078247 (2006-04-01), Lee et al.

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