Optical modeling apparatus

Details Optical modeling apparatus Optical modeling apparatus

2007-12-21

2010-11-16

Nguyen, Khanh (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

Means applying electrical or wave energy directly to work

Radiated energy

C264S492000, C264S494000, C264S401000, C264S497000, C700S118000, C700S119000, C700S120000

Reexamination Certificate

active

07833000

ABSTRACT:
There is provided an optical modeling apparatus that forms a model of a desired shape by sequentially forming hardened layers by irradiating a light-curable resin with light. The apparatus includes a first light source that emits a light beam for plotting on the resin, a scanning device that scans the light beam from the first light source over the resin, a second light source that emits light that irradiates one fixed region of the resin at a time, and a spatial light modulator that spatially modulates the light from the second light source to blanket-expose a specified region of the resin. The light beam from the scanning device and the light from the spatial light modulator form each hardened layer.

REFERENCES:
patent: 5287435 (1994-02-01), Cohen et al.
patent: 5353155 (1994-10-01), Miller
patent: 5933230 (1999-08-01), Imaino et al.
patent: 6393219 (2002-05-01), Sensui
patent: 6500378 (2002-12-01), Smith
patent: 6882469 (2005-04-01), Tamaki et al.
patent: 6899440 (2005-05-01), Bierhuizen
patent: 7463394 (2008-12-01), Shechterman
patent: 2005/0286115 (2005-12-01), Aubuchon et al.
patent: 5-77323 (1993-03-01), None
patent: 2001-297976 (2001-10-01), None
U.S. Appl. No. 11/953,388, filed Dec. 10, 2007, Kihara, et al.

Affiliated with

Also associated with

Rating

Optical modeling apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical modeling apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical modeling apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4177524