Optical microlithography apparatus with a local alignment system

Details Optical microlithography apparatus with a local alignment system Optical microlithography apparatus with a local alignment system

1985-02-15

1987-08-11

Evans, F. L.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

356399, G01B 1100

Patent

active

046858075

ABSTRACT:
An optical microlithography apparatus with a local alignment system is applicable to the production of integrated circuits. The local alignment system comprises a beam splitter between the photoreduction lens and the integrated circuit wafer, a sighting lens, an illumination source and an alignment pattern in the focal plane of the sighting lens. The source illuminates an area of the wafer around the position finding mark associated with each integrated circuit. The image of said mark is reflected into the focal plane of the sighting lens. A means then displaces the wafer in order to bring about coincidence between the image of the position finding mark and the alignment pattern.

REFERENCES:
patent: 3751170 (1973-08-01), Hidaka
patent: 4385838 (1983-05-01), Nakazawa et al.
patent: 4419013 (1983-12-01), Heimer

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