Electric heating – Metal heating – By arc
Reexamination Certificate
2002-11-25
2004-09-14
Heinrich, Samuel M. (Department: 1725)
Electric heating
Metal heating
By arc
C219S121840
Reexamination Certificate
active
06791061
ABSTRACT:
TECHNICAL FIELD
The present invention relates to an optical processing apparatus that processes a workpiece with laser.
BACKGROUND ART
A conventional optical processing apparatus shown in
FIG. 2
converges light emitted by semiconductor laser
101
which converts electrical energy into optical energy (electric circuit is not illustrated here), and irradiates the light to workpiece
111
. In an optical processing apparatus used for manufacturing processes, radiating faceplate
102
of semiconductor laser
101
and a group of lenses
105
that compose an optical convergence system are provided on their surfaces with special surface treatment for antireflection of the light in order to effectively use the optical energy generated. Respective surfaces of radiating faceplate
102
of the semiconductor laser
101
and the group of lenses
105
are damaged if getting wet with waterdrops due to, e.g., dew formation, thereby preventing the apparatus from producing a sufficient output.
To prevent such a problem, the conventional processing apparatus is equipped with desiccant
113
within hermetically-sealed interior space
103
accommodating the semiconductor laser
101
and the group of lenses
105
. Desiccant
113
prevents contaminant such as waterdrops from adhering to the surface of radiating faceplate
102
of the semiconductor laser
101
.
Shielding gas
110
needs to be supplied into in-process area
112
of workpiece III to protect it from surrounding air when the converged light is used for processing such as welding. For this reason, shielding gas
110
is supplied usually with side nozzle
108
mounted to a position at an angle different from that of the optical processing apparatus.
Semiconductor laser
101
and the group of lenses
105
represent major heat-generating elements. For the semiconductor laser
101
, in particular, a water-cooling structure is mainly used, while thermo-electric cooling system using the Peltier effect may be employed as another method in certain instances. In the group of lenses
105
, if a large temperature change occurs during the processing in enclosure
104
holding the lenses, the change influences positional accuracy as well as optical accuracy of the group of lenses
105
for converging the light, thus causing a change in the convergent characteristic, that is, performance of the processing. A processing apparatus may include a part of group of lenses
105
water-cooled for this reason.
The group of lenses
105
is provided with cover glass
107
for protecting them from contaminant gases such as fumes, emanating particles such as dust generated during the processing from in-process area
112
of the workpiece
111
.
The conventional optical processing apparatus has a complex structure to accommodate the semiconductor laser
101
and the group of lenses
105
, since employing the conventional method of preventing moisture and dust, which requires an increase in hermeticity of interior space
103
. The processing apparatus also requires a complicated procedure to handle, as it needs periodical change of the desiccant
113
.
Moreover, a vortex of surrounding air, which may result in improper shielding of the in-process area
112
, may be generated depending on mounting angle &thgr; of side nozzle
108
for supplying shielding gas
110
to protect in-process area
112
of the workpiece
111
from the surrounding air, a distance d from in-process area
112
, and inclination angle &ggr; of side nozzle
108
with respect to direction X of the processing.
The optical processing apparatus is provided with a water-cooling structure mainly for the semiconductor laser
101
, in order to reduce temperature during the processing. Even with other cooling methods, a temperature gradient may increase between a cooled end and a heat source within the semiconductor laser
101
if a temperature of interior space
103
rises, which leads to an increase in temperature of the heat source, i.e. a light-generating section. This affects an operational life of the semiconductor laser
101
.
In addition, it is difficult to cool the entire group of lenses
105
due to problems relative to water-cooling of the group of lenses
105
, such as difficulty in ensuring water-tightness, complexity of the structure, increase in processing cost associated with these problems. Accordingly, there has been a limitation in maintaining the processing performance stable. Furthermore, cover glass
107
is liable to being stained quickly as being exposed directly to contaminant gas and emanating particles. This requires cover glass
107
to be replaced promptly in order to be prevented from degradation of the processing performance, thereby giving rise to a problem in work-hours and cost.
DISCLOSURE OF THE INVENTION
An optical processing apparatus which is easily handled and has an outstanding processing performance is provided.
The optical processing apparatus includes a laser source, an enclosure which accommodates the laser source and having an inlet opening for introducing gas and an outlet opening for discharging the gas, a lens disposed to a path of laser irradiated from the laser source, a lens holder for supporting the lens, and a cylinder covering an exterior of the lens holder to form a space with the lens holder for guiding the gas to flow through the space.
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Fujii Koji
Hirasawa Kazushige
Nagayasu Dokei
Ryudo Makoto
Heinrich Samuel M.
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
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