Etching a substrate: processes – Forming or treating optical article
Patent
1993-03-29
1996-10-08
Dang, Thi
Etching a substrate: processes
Forming or treating optical article
216 33, 216 39, 385 14, 385132, G02B 600
Patent
active
055628389
ABSTRACT:
HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.
REFERENCES:
patent: 3641332 (1972-02-01), Reick et al.
patent: 4883743 (1989-11-01), Booth et al.
patent: 5061020 (1991-10-01), Ishikawa
patent: 5170448 (1992-12-01), Ackley et al.
patent: 5317082 (1994-05-01), Beuhler et al.
B. L. Booth, "Low Loss Channel Waveguides in Polymers", Journal of Lightwave Technology, vol. 7, No. 10, Oct., 1989, pp. 1445-1453.
R. Selvaraj et al., "Integrated Optical Waveguides in Polyimide for Wafer Scale Integration", Journal of Lightwave Technology, vol. 6, No. 6, Jun., 1988, pp. 1034-1044.
Cole Herbert S.
Henkes John L.
Wojnarowski Robert J.
Dang Thi
Krauss Geoffrey H.
Martin Marietta Corporation
Rees Brian J.
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