Optical: systems and elements – Polarization without modulation – Polarization using a time invariant electric – magnetic – or...
Reexamination Certificate
2005-09-27
2005-09-27
Juba, Jr., John (Department: 2872)
Optical: systems and elements
Polarization without modulation
Polarization using a time invariant electric, magnetic, or...
C359S494010, C359S490020, C372S703000
Reexamination Certificate
active
06950235
ABSTRACT:
Optical isolators and methods of manufacturing optical isolators are disclosed. The optical isolators are manufactured by directly bonding the parts of the isolators without the use of adhesive or mechanical devices to hold the individual parts together.
REFERENCES:
patent: 4186999 (1980-02-01), Harwood et al.
patent: 4407667 (1983-10-01), LeNoane et al.
patent: 4479819 (1984-10-01), Borelli et al.
patent: 4530452 (1985-07-01), Balyasny et al.
patent: 4626068 (1986-12-01), Caldwell
patent: 4960331 (1990-10-01), Goldman et al.
patent: 5183710 (1993-02-01), Gerbino
patent: 5319483 (1994-06-01), Krasinski et al.
patent: 5346583 (1994-09-01), Basavanhally
patent: 5441803 (1995-08-01), Meissner
patent: 5451547 (1995-09-01), Himi et al.
patent: 5452122 (1995-09-01), Tsuneda et al.
patent: 5579421 (1996-11-01), Duvall et al.
patent: 5631986 (1997-05-01), Frey et al.
patent: 5689519 (1997-11-01), Fermann et al.
patent: 5785874 (1998-07-01), Eda
patent: 5846638 (1998-12-01), Meissner
patent: 5852622 (1998-12-01), Meissner et al.
patent: 5915193 (1999-06-01), Tong et al.
patent: 5932048 (1999-08-01), Furukawa et al.
patent: 5989372 (1999-11-01), Momoda et al.
patent: 6030883 (2000-02-01), Nishimoto et al.
patent: 6048103 (2000-04-01), Furukata et al.
patent: 6098429 (2000-08-01), Mazabraud et al.
patent: 6120917 (2000-09-01), Eda
patent: 6129854 (2000-10-01), Ramsey et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6178779 (2001-01-01), Drouart et al.
patent: 6249619 (2001-06-01), Bergmann et al.
patent: 6275336 (2001-08-01), Yoshikawa et al.
patent: 6359733 (2002-03-01), Iwatsuka et al.
patent: 6429144 (2002-08-01), Vines et al.
patent: 6548176 (2003-04-01), Gwo
patent: 6580842 (2003-06-01), Hehlen et al.
patent: 6583029 (2003-06-01), Abe et al.
patent: 6600601 (2003-07-01), Ikari et al.
patent: 6621630 (2003-09-01), Iwatsuka
patent: 2002/0005987 (2002-01-01), Wills et al.
patent: 2002/0108556 (2002-08-01), Ebbers
patent: 2002/0186915 (2002-12-01), Yu et al.
patent: 2003/0079503 (2003-05-01), Cook et al.
patent: 2003/0079823 (2003-05-01), Sabia
patent: 2003/0081906 (2003-05-01), Filhaber et al.
patent: 2003/0081930 (2003-05-01), Filhaber et al.
patent: 2003/0206345 (2003-11-01), Sabia et al.
patent: 197 31 075 (1999-01-01), None
patent: 19731075 (1999-01-01), None
patent: 1 057 793 (2000-12-01), None
patent: 03-115178 (1991-05-01), None
patent: 08146351 (1996-06-01), None
patent: 08-146351 (1996-06-01), None
patent: P2000-56265 (2000-02-01), None
patent: 52[1977]-78454 (2000-03-01), None
patent: 2002321947 (2002-11-01), None
patent: WO01/98225 (2001-12-01), None
“Process for Bonding Workpieces of Metal, Semimetal and Compounds Thereof”, English-language translation of DE 19731075A1, Schreiber Translations, Inc.
Onishi et al., “A novel temperature compensation method for SAW devices using direct bonding Techniques,”Ultrasonics Symp, 1997, IEEE Proceedings, Oct, 5-8, 1997 pp. 227-230.
“Wafer Direct Bonding: Tailoring Adhesion Between Brittle Materials”; Materials Science and Engineering; R25 (1999)1-88, Plössl, et al.
Arthur Landrock; “Surface Preparation of Adherends”; Adhesives Technology Handbook; 1985; p. 117-118.
A. Sayah, D. Solignac, T.Cueni, “Development of novel low temperature bonding technologies for microchip chemical analysis applications”, Sensors and Actuators, 84 (2000) pp. 103-108.
P. Rangsten, O. Vallin, K. Hermansson, Y. Backlund, “Quartz-to-Quartz Direct bonding”, J. Electrochemical Society, V. 146, N.3, pp. 1104-1105, 1999).
H. Nakanishi, T. Nishimoto, M. Kani, T. Saitoh, R. Nakamura, T. Yoshida, S. Shoji, “Condition Optimization, Reliability Evaluation of SiO2-SiO2HF Bonding and Its Application for UV Detection Micro Flow Cell”, Sensors and Actuators, V. 83, pp. 136-141, 2000.
A. Yamada, et al. “Bonding Silicon wafer to Silicon Nitride with Spin-on Glass Adhesive”, Electronics Letters, Mar. 26, 1987, vol. 23, No. 7.
D.J. Harrison, et al. “Micromachining a Miniaturized Capillary Electrophoresis-Based Chemical Analysis System on a Chip”, Science 261 (1993) 895-897.
W.P. Maszara, “Silicon-on-insulator by Wafer Bonding: A Review”, J. Electrochemical Society 138 (1991) 341-347.
D-W. Shin, et al., “The Stacking Faults and Their Strain Effect at the SI/SiO2Interfaces of a Directly Bonded SOI (Silicon on insulator)”, Thin Solid Firms, V. 346, pp. 169-173, 1999.
Q-Y. Tong, et al “The Role of Surface Chemistry in Bonding of Standard Silicon Wafers”, J. Electrochemical Society, V. 144, N.1, pp. 384-389, 1997.
Mann Larry G.
Quinn Candace J.
Sabia Robert
Chen Siwen
Corning Incorporated
Jr. John Juba
Schaeberle Timothy M.
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