Optical waveguides – Integrated optical circuit
Reexamination Certificate
2007-10-16
2007-10-16
Connelly-Cushwa, Michelle R. (Department: 2874)
Optical waveguides
Integrated optical circuit
C385S037000, C385S048000
Reexamination Certificate
active
11216572
ABSTRACT:
Systems and methods, including azimuthally asymmetric fiber gratings are disclosed.
REFERENCES:
patent: 3982810 (1976-09-01), Tamir et al.
patent: 4380365 (1983-04-01), Gross
patent: 4476161 (1984-10-01), Pohle et al.
patent: 4785167 (1988-11-01), Madrid
patent: 5046800 (1991-09-01), Blyler, Jr. et al.
patent: 5130356 (1992-07-01), Feuerherd et al.
patent: 5302656 (1994-04-01), Kohara et al.
patent: 5359208 (1994-10-01), Katsuki et al.
patent: 5430817 (1995-07-01), Vengsarkar
patent: 5434196 (1995-07-01), Ohkawa et al.
patent: 5462995 (1995-10-01), Hosaka et al.
patent: 5581414 (1996-12-01), Snyder
patent: 5647039 (1997-07-01), Judkins et al.
patent: 5657407 (1997-08-01), Li et al.
patent: 5703978 (1997-12-01), DiGiovanni et al.
patent: 5757540 (1998-05-01), Judkins et al.
patent: 5764829 (1998-06-01), Judkins et al.
patent: 5852690 (1998-12-01), Haggans et al.
patent: 5864641 (1999-01-01), Murphy et al.
patent: 5896479 (1999-04-01), Vladic
patent: 6005999 (1999-12-01), Singh et al.
patent: 6011886 (2000-01-01), Abramov et al.
patent: 6021240 (2000-02-01), Murphy et al.
patent: 6022498 (2000-02-01), Buazza et al.
patent: 6035082 (2000-03-01), Murphy et al.
patent: 6039897 (2000-03-01), Lochhead et al.
patent: 6156394 (2000-12-01), Schultz Yamasaki et al.
patent: 6206673 (2001-03-01), Lipscomb et al.
patent: 6253004 (2001-06-01), Lee et al.
patent: 6259567 (2001-07-01), Brown et al.
patent: 6262414 (2001-07-01), Mitsuhashi
patent: 6272275 (2001-08-01), Cortright et al.
patent: 6278817 (2001-08-01), Dong
patent: 6281508 (2001-08-01), Lee et al.
patent: 6427041 (2002-07-01), Strasser et al.
patent: 6432328 (2002-08-01), Hamanaka et al.
patent: 6500603 (2002-12-01), Shioda
patent: 6865320 (2005-03-01), Westbrook
patent: 6870991 (2005-03-01), Ohta et al.
patent: 6885792 (2005-04-01), Eggleton et al.
patent: 6892001 (2005-05-01), Ohta et al.
patent: 2002/0041745 (2002-04-01), Lee et al.
patent: 2006/0013527 (2006-01-01), Morel et al.
Chen, et al.; Fully Embedded Board-Level Guided-Wave Optoelectronic Interconnects; Jun. 2000; Proceedings of IEEE, vol. 88, No. 6; pp. 780-793.
Wiesmann, et al.; Singlemode Polymer Waveguides for Optical Backplanes; Dec. 5, 1996; Electronics Letters, vol. 32, No. 25; pp. 2329-2330.
Barry, et al.; Highly Efficient Coupling Between Single-Mode Fiber and Polymer Optical Waveguides; Aug. 1997; IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, vol. 20, No. 3; pp. 225-228.
Lee, et al.; Fabrication of Polymeric Large-Core Waveguides for Optical Interconnects Using a Rubber Molding Process; Jan. 2000; IEEE Photonics Technology Letters, vol. 12, No. 1; pp. 62-64.
Schmeider, et al.; Electro-Optical Printed Circuit Board (EOPCB); 2000 Electronic Components and Technoogy Conference; pp. 749-753.
Mederer, et al.; 3Gb/s Data Transmission With GaAs VCSELs Over PCB Integrated Polymer Waveguides; Sep. 2001; IEEE Photonics Technology Letters, vol. 13, No. 9; pp. 1032-1034.
Schröder, et al.; Polymer Optical Interconnects for PCB; 2001; Session 13: Photonic Polymers II; pp. 337-343.
Glukh, et al.; High performance Polymeric Materials for Waveguide Applications; Aug. 2000; SPIE—The International Society for Optical Engineering, inear, Nonlinear, and Power Limiting Organics, San Diego, vol. 4106; pp. 1-11.
Liu, et al.; Plastic VCSEL Array Packaging and High Density Polymer Waveguides for Board and Backplane Optical Interconnect; 1998; Electronic Components and Technology Conference; pp. 999-1005.
Bakir, et al.; Sea of Dual Mode Polymer Pillar I/O Interconnections for Gigascale Integration; 2003; IEEE International Solid State Circuits Conference; 8 pages.
Beuret, et al.; Microfabrication of 3D Multidirectional Inclined Structure by UV lithography and Electroplating; Micro Electro Mechanical Systems, 1994, MEMS'94, Proceedings, IEEE Workshop on Jan. 25-28, 1994; pp. 81-85.
Wang, et al.; Studies on A Novel Flip-Chip Interconnect Structure-Pillar Bump; Electronic Components and Technology Conference, 2001, Proceedings, 51st, 29 May 1, Jun. 2001; pp. 945-949.
Bakir, et al.; Sea of Polymer Pillars: Dual-Mode Electrical Optical Input/Output Interconnections; in Proc. of Int. Interconnect Technology Conference; pp. 77-79; 2003.
Bakir, et al.; Sea of Polymer Pillars: Compliant Wafer-Level Electrical-Optical Chip I/O Interconnections; IEEE Photonics Technology Letters, vol. 15, No. 11, Nov. 2003; pp. 1567-1569.
Bakir, et al.; Optical Transmission of Polymer Pillars for Chip I/O Optical Interconnections; IEEE Photonics Technology Letters, vol. 16, No. 1, Jan. 2004; pp. 117-119.
Chandrasekhar, et al.; Modeling and Characterization of the Polymer Stud Grid Array (PSGA) Package: Electrical, Thermal and Thermo-Mechanical Qualification; IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, No. 1, Jan. 2003; pp. 54-67.
Bakir, et al; Sea of Polymer Pillars Electrical and Optical Chip I/O Interconnections for Gigascale Integration; IEEE Transactions on Electron Devices; vol. 51, No. 7; Jul. 2004; pp. 1069-1077.
Bakir, et al.; Integration of Optical Polymer Pillars Chip I/O Interconnections with Si MSM Photodetectors; IEEE Transactions on Electron Devices; vol. 51, No. 7; Jul. 2004; pp. 1084-1090.
W. Wayt Gibbs; Computing at the Speed of Light; Scientific American; Nov. 2004; pp. 81-87.
John Baliga; Polymer Pillars for Optical and Electrical Signals; Semiconductor International; Dec. 2004; p. 36.
Richard Ball; ISSCC: Polymer Pillars Used to Connect Die; Electronics Weekly Archive; Feb. 2003.
Ron Wilson; Session Examines Novel Semiconductor Devices; EE Times; Feb. 12, 2003; URL: http://eetimes.com/article/showArticle.jhtml?articleID=18308034.
Bachim Brent L.
Gaylord Thomas K.
Connelly-Cushwa Michelle R.
Georgia Tech Research Corporation
Peace Rhonda S.
Thomas Kayden Horstemeyer & Risley LLP
LandOfFree
Optical interconnects in microelectronics based on... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical interconnects in microelectronics based on..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical interconnects in microelectronics based on... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3903072