Optical interconnects in integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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C257S099000

Reexamination Certificate

active

07023023

ABSTRACT:
An integrated circuit die includes optical interconnect ports on a first side and electrical interconnect ports on a second side.

REFERENCES:
patent: 6380563 (2002-04-01), Farnworth et al.
patent: 6608359 (2003-08-01), Kitahata
patent: 6803639 (2004-10-01), Ono et al.
patent: 2004/0217366 (2004-11-01), Gale et al.
Hochneg, H, et al., “Formation of Micro-Lens by Reflow of Dual Photoresist”,Digest of Papers Microprocesses and Nanothechnology, 2002 International Microprocesses and Nanotechnology Conference,(Nov. 2002), pp. 198-199.
King, Wilton W., et al., “Modular Adapters for Fiber Optics”,IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21, No. 1,(Mar. 1998), pp. 186-191.
Ng, Wai L., et al., “An efficient room-temperature silicon-based light-emitting diode”,Nature, vol. 410,(Mar. 8, 2001), pp. 192-194, 470.
Yee, Youngjoo , et al., “Micro Solid Immersion Lens Fabricated by Micro-Molding for Near-Field Optical Data Storage”,2000 IEEE/LEOS International Conference on Optical MEMS, (Aug. 2000), pp. 91-92.

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