Optical interconnect module

Details Optical interconnect module Optical interconnect module

1999-11-10

2001-08-07

Bovernick, Rodney (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S053000, C385S147000, C385S089000, C385S092000, C361S699000

Reexamination Certificate

active

06270262

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to the field of fiber optical connections with optoelectronic transducers, and more particulary, this invention relates to an optical interconnect module used for connecting optical fibers to optoelectronic transducers and electronic components mounted on printed wiring circuit boards.
BACKGROUND OF THE INVENTION
In many military electronics used in airborne applications, circuit boards are cooled in a more efficient manner than typically used for commercial electronic applications. For example, jet aircraft are designed to fly at high altitudes where there is little oxygen and air that could be used for standard cooling of electronic components as in personal computers, where a fan blows air over the integrated circuit chip and other components. Often designers of the various electronic components that are used in fighter aircraft and other high altitude aircraft place circuit boards in close proximity to each other and insert a perforated core between the two circuit boards. A fluid, such as a liquid or a gas, is forced through the perforated core to cool the electronic components. Often, fiber optic communication systems are used in combination with optoelectronic transducers. However, the total thickness of these modules formed by opposing circuit boards should be thin, because the modules are stacked in racks throughout the aircraft. Thus, when optoelectronic transducers are placed on the outside of the boards, the width of the boards, together with the height of the optoelectronic transducers, becomes greater than the designed specifications. Additionally, optoelectronic transducers are more temperature sensitive and tend to become heated up by adjacent electronic components. Thus, not only is there a problem in prior art components concerning the general overall width of these electronic optical interconnect module, but there is also the problem that opticoelectronic transducers, which receive and transmit light signals, become less efficient, and may even cease to function due to heat from adjacent and nearby electronic components also mounted on the circuit boards.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an optical interconnect module where an optoelectronic transducer is mounted separately from electronic components that are normally mounted on the circuit carrying face of printed wire circuit boards and cooled separately.
It is still another object of the present invention to provide an optical interconnect module that has minimum thickness in accordance with many specifications for fixed and rotary wing aircraft.
In accordance with the present invention, an optical interconnect module includes a pair of rectangular configured circuit boards spaced in close proximity to each other. Each pair of rectangular configured circuit boards includes an outer circuit carrying side. An inner plenum is defined between the boards and open end is formed. A mounting member engages the circuit boards and secures the boards together to form a module. A plurality of electronic components are mounted on the outer circuit carrying sides.
A cooling core is mounted within the inner plenum and engages the circuit boards for cooling the electronic components mounted on the circuit boards as coolant is passed through the cooling core. At least one optoelectronic transducer assembly is mounted at the open end of the formed module and operatively connected to a circuit carrying face of one of the circuit boards. The cooling core engages the optoelectronic transducer assembly and provides cooling to the transducer assembly. An optical fiber is mounted in communication with the optoelectronic transducer assembly at the open end of the formed module.
In still another aspect of the present invention, the optoelectronic transducer assembly further comprises a substantially planar substrate having a die carrying face mounted opposite a circuit carrying face of a circuit board. An electronic die is mounted on the die carrying face and at least one of the electronic die is mounted on the die carrying face and is electrically connected to a circuit formed on the circuit carrying face. A circuit carrying extension is mounted on the planar substrate and extends over the open end of the formed module. A diode is mounted on the circuit carrying extension.
In still another aspect of the present invention, the optoelectronic transducer assembly can further comprise a substantially planar substrate having a die carrying face mounted opposite a circuit carrying face of a circuit board. The electronic die is mounted on the die carrying face and at least one of the electronic die is mounted on the die carrying face and is electrically connected to a circuit formed on the circuit carrying side. A laser is supported by the planar substrate and mounted over the open end of the formed module. A copper mounting block and ceramic support member can support the laser on the planar substrate.
In still another aspect of the present invention, the optoelectronic transducer assembly can further comprise a substantially planar substrate having a die carrying face mounted opposite a circuit carrying face of a circuit board. An electronic die is mounted on the die carrying face and at least one of the electronic die is mounted on the die carrying face and electrically connected to a circuit formed on the circuit carrying side. A diode and prism are supported by the planar substrate and mounted over the open end of the formed module.
In still another aspect of the present invention, the cooling core can comprise a perforated core member through which fluid is passed between the pair of rectangular configured circuit boards. In still another aspect of the present invention, the coolant can comprise a fluid, or can be a gas. The cooling core includes an inlet and outlet for fluid.
In yet another aspect of the present invention, an optical interconnect assembly comprises a fiber optic back plane having a plurality of receiving slots for receiving an optical interconnect module within each slot. The fiber optic back plane includes a cooling circuit and coolant fittings positioned at each slot through which coolant can be passed through an optical interconnect module positioned within each receiving slot. At least one optical interconnect module is connected within the receiving slot. This optical interconnect module can further comprise a pair of rectangular configured circuit boards spaced in close proximity to each other and having two outer circuit carrying sides, an inner plenum defined between the boards, and an open end. A mounting member is fixed into the receiving slot and engages the circuit boards and secures the boards together to form a module. A plurality of electronic components are mounted on the outer circuit carrying faces. A cooling core is mounted within the inner plenum and connected to the coolant fittings for receiving coolant. The cooling core engages the circuit boards for cooling the electronic components mounted on the circuit boards as coolant is passed through the cooling core. At least one optoelectronic transducer assembly is mounted at the open end of the module and operatively connected to a circuit carrying side of one of the circuit boards. The cooling core engages the optoelectronic transducer assembly to provide cooling to the transducer assembly. An optical fiber is mounted in communication with the optoelectronic transducer assembly at the open end of the formed module.


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