Optical inspection system for semiconductor wafers

Details Optical inspection system for semiconductor wafers Optical inspection system for semiconductor wafers

1984-10-22

1987-04-21

Willis, Davis L.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

358106, G01N 2155

Patent

active

046592202

ABSTRACT:
A method and apparatus for automatically detecting defects on the surfaces of semiconductor wafers and chips which provides a 100% inspection capability. The entire surface of each wafer is scanned by use of a low magnification, low resolution detector such as a photodiode array. Whenever a defect occurs, encoders on the supporting XY table are triggered, such that the location of a defect on the wafer is recorded. After the event coordinates have been determined, the XY table positions each defect directly under a high magnification detector to determine the nature of the detected event. Since only the locations of the detected events are stored, 100% of the processed wafers can be scanned for defects.

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IBM TDB, Nov. '81, p. 3059; Automatic Inspection and Computation Tool of Patterned Semiconductor Wafers; M. Barret.
IBM TDB, May '83, pp. 6558-6559; Defects Detection by Spacial Correlation of Images, N. Begnoche.

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