Optical inspection system for a wafer

Details Optical inspection system for a wafer Optical inspection system for a wafer

2008-01-17

2010-06-15

Chowdhury, Tarifur (Department: 2886)

Optics: measuring and testing

Dimension

Thickness

C356S237400, C356S237500

Reexamination Certificate

active

07738119

ABSTRACT:
Provided is an optical inspection system for a semiconductor wafer, by which a threshold value optimal for inspection can be determined and optical inspection of each chip can be performed based on the threshold value, by obtaining in advance a table indicating a relation between a film thickness of a thin film in specific positions in the wafer and a gradation value for each sample area in the chip, measuring the film thickness of the thin film in the specific positions of the wafer to be inspected before inspecting the chip, and comparing the measured film thickness with the gradation value in the table.

REFERENCES:
patent: 7375829 (2008-05-01), Kang
patent: 2004-93338 (2004-03-01), None

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