Optical inspection system and method

Details Optical inspection system and method Optical inspection system and method

2010-03-01

2011-12-06

Stock, Jr., Gordon (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500, C382S145000

Reexamination Certificate

active

08072591

ABSTRACT:
A wafer inspection system has a bright field imaging beam path and a dark field imaging beam path to obtain bright field images and dark field images of a full 300 mm wafer. The optical system provides for telecentric imaging and has low optical aberrations. The bright field and dark field beam paths are folded such that the system can be integrated to occupy a low volume with a small foot print.

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Final Office Action for U.S. Appl. No. 12/916,336 mailed on Jun. 30, 2011, 6 pages.
Non-Final Office Action for U.S. Appl. No. 12/916,315 mailed on Jul. 25, 2011, 11 pages.

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