Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2011-01-11
2011-01-11
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
Reexamination Certificate
active
07869025
ABSTRACT:
An optical semiconductor wafer inspection system and a method thereof are provided for classifying and inspecting defects such as scratches, voids and particles produced in a flattening process by a polishing or grinding technique used for semiconductor manufacturing. The present invention is an optical semiconductor wafer inspection system and a method thereof characterized by obliquely illuminating a scratch, void or particle produced on the surface of a polished or ground insulating film at substantially the same velocity of light, detecting scattered light at the time of oblique illumination from the surface of an inspection target at different angles and thereby classifying the scratch, void or particle.
REFERENCES:
patent: 2006/0068512 (2006-03-01), Ohshima et al.
patent: 2008/0059094 (2008-03-01), Shimura et al.
patent: 2006-201179 (2006-08-01), None
patent: 2007-302997 (2007-11-01), None
Ochi Masayuki
Soeda Hideki
Hitachi-High-Technologies Corporation
McDermott Will & Emery LLP
Merlino Amanda H
Toatley , Jr. Gregory J.
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