Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-08-22
2006-08-22
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S704000, C257S711000
Reexamination Certificate
active
07095109
ABSTRACT:
An optical fiber terminator package is provided. The package comprises: (a) a semiconductor chip having a top surface and a bottom surface; (b) at least one optical device positioned on or in the top surface; and (c) a first hollow cap bonded to the top surface and positioned at least partially over the at least one optical device. The first hollow cap is a one-piece molded cap and comprises: (i) a roof and sidewalls extending therefrom to the top surface; (ii) a first region in the roof which is substantially transparent to electromagnetic radiation; and (iii) at least one attachment means for attaching a optical fiber to the first hollow cap.
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Jim KL et al., “Fabrication of wafer level chip scale packaging for optoelectronic devices” 1989 Proceedings 49th Electronic Components and Technology Conference ECTC 1999. San Diego, CA, Jun. 1-4, 1999. Proceedings of the Electronic Components and Technology Conference, New York, NY: IEEE, US, Jun. 1 1999, pp. 1145-1147, XP002248941 ISBN: 0-7803-5232-7 *figure 1*.
No affiliations
Nelms David
Nguyen Thinh T
Silverbook Research Pty Ltd
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