Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1982-12-23
1984-12-18
Lee, John
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
350 9625, 350 9629, 427163, G02B 726
Patent
active
044887736
ABSTRACT:
An array of optical fibers is precisely positioned in channels in a head when liquid metal, such as tin-lead solder, is used. This is compared to irregular locating which is obtained with organic resins. A glass fiber is first ion plated with about 1.times.10.sup.-6 m of a metal such as nickel which is wetted by the solder. The fiber is placed loosely in a channel in a metal holder and solder is infiltrated. In an embodiment, strain on the glass fiber where it exits its holder channel is alleviated when the polymer jacket is also ion plated with metal and soldered to the holder.
REFERENCES:
patent: 3871935 (1975-03-01), Gloge et al.
patent: 4119363 (1978-10-01), Camlibel et al.
patent: 4252457 (1981-02-01), Benson et al.
patent: 4295707 (1981-10-01), Nakai et al.
patent: 4350744 (1982-09-01), Snitzer et al.
patent: 4358512 (1982-11-01), Richter
patent: 4389086 (1983-06-01), Furusawa et al.
Esposito, John J., "Epoxyless Fiber Optic Connector Concepts for Single-Fiber Cables", Electronic Packaging and Production, Jan. 1979, pp. 216-220.
Electronics, "International Newsletter", Jul. 17, 1980, p. 67.
Lee John
Nessler C. G.
United Technologies Corporation
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