Optical fiber encapsulation techniques

Details Optical fiber encapsulation techniques Optical fiber encapsulation techniques

1994-02-24

1995-02-28

Lee, John D.

Optical waveguides

Accessories

Plug/termination device

156176, 156297, 1563096, 156312, 385 80, 385114, G02B 644, B29C 6518

Patent

active

053945042

ABSTRACT:
Optical fibers are encapsulated, first by bonding them to a first surface (18) of a flat member (17) having first and second opposite major surfaces. The flat member and a sheet of thermoplastic (13) are placed in an air-tight chamber (10) such that a first major surface of the sheet faces the first major surface (18) of the flat member (17). Next, the air pressure on the second major surface of the flat member is made to be significantly lower than the air pressure on the second surface of the thermoplastic sheet (13), thereby to cause the sheet to press against the flat member. The thermoplastic sheet is heated sufficiently during this process to cause it to adhere to the first surface (18) of the flat member, thereby to encapsulate the optical fibers.

REFERENCES:
patent: 3271214 (1966-09-01), Tabor
patent: 3666587 (1972-05-01), Nagao
patent: 3871935 (1975-03-01), Gloge et al.
patent: 4138193 (1979-02-01), Olszewski et al.
patent: 4541882 (1985-09-01), Lassen
patent: 4715700 (1987-12-01), Daniel
patent: 5204925 (1993-04-01), Bonanni et al.
patent: 5259051 (1993-11-01), Burack et al.
patent: 5292390 (1994-03-01), Burack et al.
"Electro-Optical Board Technology Base on Discrete Wiring," by W. Delbare et al., presented at 1991 International Electronics Packaging Conference, Sep. 17, 1991, pp. 604-618.

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