Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2006-08-10
2010-11-16
Vinh, Lan (Department: 1713)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345240, C156S345400, C438S007000, C438S710000
Reexamination Certificate
active
07833381
ABSTRACT:
The present invention provides a method and apparatus for improving optical sensing of a plasma process through the use of a fiber optic sensor placed within a standard showerhead hole of a standard gas showerhead positioned in an upper electrode of a plasma system during the plasma processing of a substrate. A film property can be calculated based on the measured plasma emission from the surface of the substrate. The film property can be film deposition rate, refractive index, film thickness, etc. Based on the measured film property, the plasma processing of the substrate can be adjusted and/or terminated. In addition, a window is provided that is positioned in the upper electrode assembly for viewing the plasma emission through the standard showerhead hole.
REFERENCES:
patent: 4328068 (1982-05-01), Curtis
patent: 4496425 (1985-01-01), Kuyel
patent: 4948259 (1990-08-01), Enke et al.
patent: 5223914 (1993-06-01), Auda et al.
patent: 5242532 (1993-09-01), Cain
patent: 5450205 (1995-09-01), Sawin et al.
patent: 5578161 (1996-11-01), Auda
patent: 5658418 (1997-08-01), Coronel et al.
patent: 5807761 (1998-09-01), Coronel et al.
patent: 5846373 (1998-12-01), Pirkle et al.
patent: 6071375 (2000-06-01), Chen et al.
patent: 6159297 (2000-12-01), Herchen et al.
patent: 6203620 (2001-03-01), Moslehi
patent: 6264852 (2001-07-01), Herchen et al.
patent: 6381021 (2002-04-01), Somekh et al.
patent: 6448094 (2002-09-01), Yamazawa et al.
patent: 6641747 (2003-11-01), Lukanc et al.
patent: 6758941 (2004-07-01), Ookawa et al.
patent: 6815653 (2004-11-01), Tsay et al.
patent: 6939811 (2005-09-01), Kamp et al.
patent: 6977184 (2005-12-01), Chou et al.
patent: 7001529 (2006-02-01), Han et al.
patent: 7018553 (2006-03-01), Liu et al.
patent: 7026173 (2006-04-01), Yamashita et al.
patent: 7033518 (2006-04-01), Yang et al.
patent: 2001/0015175 (2001-08-01), Masuda et al.
patent: 2003/0038112 (2003-02-01), Liu et al.
patent: 2004/0040658 (2004-03-01), Usui et al.
patent: 2004/0084146 (2004-05-01), Sekiya
patent: 2004/0118517 (2004-06-01), Masuda et al.
patent: 2004/0118518 (2004-06-01), Masuda et al.
patent: 2004/0177925 (2004-09-01), Masuda et al.
patent: 2004/0191932 (2004-09-01), Fuse
patent: 2004/0197938 (2004-10-01), Saito
patent: 2004/0237888 (2004-12-01), Codella et al.
patent: 2005/0029228 (2005-02-01), Nozawa et al.
patent: 2005/0092435 (2005-05-01), Hayashi et al.
patent: 2005/0115824 (2005-06-01), Donohue et al.
patent: 2005/0154482 (2005-07-01), Tomoyasu
patent: 2006/0040415 (2006-02-01), Chou et al.
patent: 2006/0073619 (2006-04-01), Usui et al.
patent: 2006/0169410 (2006-08-01), Maeda et al.
Kauget Harvey
Phelps Dunbar LLP
Vinh Lan
LandOfFree
Optical emission interferometry for PECVD using a gas... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical emission interferometry for PECVD using a gas..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical emission interferometry for PECVD using a gas... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4219719