Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate
2001-01-31
2002-08-27
Tran, Minh Loan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
C257S082000, C257S098000, C257S100000, C257S432000
Reexamination Certificate
active
06441402
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to an optoelectronic apparatus and a method for producing the same. In particular, the present invention relates to an optoelectronic apparatus in which an optoelectronic device mounted on a resin package is sealed with an optical component, and a method for producing the same.
Examples of optoelectronic devices include a semiconductor laser device, which is a light emitting semiconductor device, and a light receiving semiconductor device. U.S. Pat. No. 5,748,658 discloses a semiconductor laser apparatus, an optical pick-up apparatus, an optical disk apparatus and the like, as an optoelectronic apparatus on which a semiconductor laser device and a light-receiving semiconductor device are mounted.
FIGS. 7A and 7B
show the structure thereof.
FIGS. 7A and 7B
are a schematic plan view and a schematic cross-sectional view of the structure, respectively. In
FIG. 7A
, an optical component
92
shown in
FIG. 7B
is omitted.
In the apparatus shown in
FIGS. 7A and 7B
, a semiconductor laser chip
70
mounted on a resin package
90
is sealed with an optical component
92
. The resin package
90
is constituted by a frame member
91
made of an insulating material, a lead frame
73
including a chip mounting portion
74
, and a protective plate
79
. The semiconductor laser chip
70
is mounted on the chip mounting portion
74
via a silicon substrate
71
for heat sink. The optical component
92
sealing the resin package
90
on which the semiconductor laser chip
70
is mounted may be an optical flat plate or a holographic optical component. In
FIGS. 7A and 7B
, a heat sink
77
and a signal processing circuit
75
are also shown.
Japanese Laid-Open Patent Publication (Tokkai) Nos. 8-288594 and 7-183414 describe a semiconductor laser apparatus in which a semiconductor laser device is sealed by mounting and fixing a holographic optical component on a resin package including a frame member having steps with an ultraviolet curable adhesive.
The above-described conventional optoelectronic apparatus and the method for producing such an optoelectronic apparatus have the following problems.
With demands for large capacity and compactness of optical disk apparatuses, there is an increasing demand for a complex combination and compactness of optical components used in a semiconductor laser apparatus that is the core of an optical pick-up apparatus included in the optical disk apparatuses. The optical components are, for example, a diffraction grating, a prism, and a holographic element, and fixed onto a package on which a semiconductor laser apparatus is placed with an adhesive. Moreover, the package has a guide wall (denoted by
89
in
FIGS. 7A and 7B
) provided for rotation adjustment by contacting with the inner wall of a cylinder for the purpose of optical alignment of the semiconductor laser apparatus and the optical disk or the like. In recent years, with development in compactness of optoelectronic apparatuses, the distance of a space between the outer periphery of the optical component (denoted by
92
in
FIGS. 7A and 7B
) and the inner wall of the guide
89
has been reduced. This space serves as an adhesion portion to which an adhesive is supplied. Since this space is small, it is difficult to supply an adhesive to the adhesion portion (the space) after the optical component is mounted on the package.
In particular, in a method using a nozzle of a producing apparatus for mass production to supply an adhesive, it is difficult to insert the nozzle in the adhesion portion of a narrow space so that the nozzle cannot sufficiently be guided for appropriate fitting in the adhesion portion. Therefore, the adhesive cannot be applied to an intended portion of the optical component. As a result, the optical component cannot hermetically be fixed onto the package.
Moreover, unnecessary adhesive is applied to portions other than the adhesive portion such as the upper portion of the optical component and the periphery of the package, which leads to poor optical characteristics and poor mechanical dimension accuracy of the package. For example, when the adhesive is applied to the outer circumference of the guide wall of the package, problems may arise in alignment in some cases depending on other producing apparatuses, because alignment is performed based on the dimension of the outer circumference. In addition, a handler may not be used for holding the package.
Furthermore, since the adhesive is supplied to the overall adhesion portion of a narrow width in a wide range, the adhesive is stuck between the outer periphery of the optical component and the inner wall of the guide before the adhesive reaches the adhesion portion, so that air bubble can be contained. Thus, sufficient adhesion cannot be achieved.
SUMMARY OF THE INVENTION
In view of the above-mentioned conventional problems, it is an object of the present invention to provide an optoelectronic apparatus that can supply an adhesive easily and a method for producing the same.
An optoelectronic apparatus of the present invention includes an optoelectronic device, a mounting portion for the optoelectronic device to be mounted on, a frame member surrounding the periphery of the mounting portion, and an optical component. The optical component is placed on an optical component placement portion positioned in an inner peripheral portion on the side of the mounting portion of an upper surface of the frame member. The frame member includes a pair of first side walls opposed to each other in a portion of an outer peripheral portion positioned on an outer periphery side than the inner peripheral portion of the upper surface of the frame member, and a pair of second side walls opposed to each other in the portion of the outer peripheral portion other than the portion on which the pair of first side walls are provided. Each of the pair of second side walls has a recessed portion formed on an inner wall side of the second side wall, and a protruded portion formed in the portion on the inner wall side other than the portion on which the recessed portion is formed. The optical component is disposed between the protruded portions of the pair of second side walls, and is fixed with an adhesive filled in the recessed portions of the second side walls.
It is preferable that the mounting portion is a die pad of a lead frame, and that the first side walls, the second side walls, the optical component placement portion and the frame member are integrally formed with resin.
It is preferable that the protruded portions of the second side walls are inclined to an outer wall side, and an outer wall of a side face of the optical component is inclined to an inner side.
It is preferable that the height of the second side walls is higher than that of first side walls, and outer walls of the second side walls are arc-shaped, and inclined to the inner wall side.
It is preferable that a side wall recessed portion is provided in the first side wall in a vicinity of a portion where the second side wall and the first side wall meets.
It is preferable that the recessed portion of the second side wall and the side wall recessed portion of the first side wall are provided substantially along one direction.
It is preferable that the first side wall is longer than a length of a longer side of the optical component, and extends up to the recessed portion of the second side wall.
It is preferable that the optical component is higher than the second side wall, and a width of the optical component is smaller than that of the second side wall.
It is preferable that the adhesive is an ultraviolet curable adhesive.
A method for producing an optoelectronic apparatus of the present invention includes (a) preparing a member including a mounting portion for an optoelectronic device to be mounted on; (b) forming a frame member surrounding a periphery of the mounting portion and comprising an optical component placement portion positioned in an inner peripheral portion on a side of the mounting portion of the upper surface of
Hirano Ryuma
Nakanishi Hideyuki
Tsuruta Toru
Matsushita Electronics Corporation
Nixon & Peabody LLP
Studebaker Donald R.
Tran Minh Loan
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