Optical devices with multiple wafers containing planar...

Details Optical devices with multiple wafers containing planar... Optical devices with multiple wafers containing planar...

2007-02-16

2008-10-14

Doan, Jennifer (Department: 2874)

Optical waveguides

Integrated optical circuit

C385S015000, C385S039000, C385S050000

Reexamination Certificate

active

07437031

ABSTRACT:
A method for fabricating an optical device wherein the device comprises a first substrate wafer with at least one buried optical waveguide on an approximately flat planar surface of the substrate and a second substrate wafer with at least a second buried optical waveguide. The waveguides so formed may be straight or curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer is turned (flipped) and bonded to the first wafer in such a manner that the waveguides, for example, may form an optical coupler or may cross over one another and be in proximate relationship along a region of each. As a result, three-dimensional optical devices are formed avoiding the convention techniques of layering on a single substrate wafer.

REFERENCES:
patent: 4896932 (1990-01-01), Cassidy
patent: 5656181 (1997-08-01), Biasse et al.
patent: 7200303 (2007-04-01), Feuer et al.

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