Optical device package for flip-chip mounting

Details Optical device package for flip-chip mounting Optical device package for flip-chip mounting

2005-04-26

2005-04-26

Healy, Brian (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S014000, C385S049000, C385S088000, C385S091000, C257S433000, C257S678000, C257S703000, C257S704000, C257S778000, C438S108000

Reexamination Certificate

active

06883977

ABSTRACT:
An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

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