Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2007-03-15
2009-11-24
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257SE33056, C257SE33057, C257SE33058, C257S100000, C257S098000, C257S687000, C257S678000, C257S701000, C257S684000, C257S784000, C257S079000, C257S734000
Reexamination Certificate
active
07622750
ABSTRACT:
An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die pad portion is bent from the substrate such that the die pad portion extends from the substrate at an angle of 90 degrees; signal lead pins extend in the opposite direction from the die pad portion relative to the substrate such that the first lead pins intersect the principal surfaces of the substrate at a right angle and are spaced apart from the metal frame; and a molded resin member including a plate-like resin base extending across and in close contact with one of the principal surfaces of the substrate, wherein the signal lead pins protrude from a surface of the resin base; surfaces of the signal lead pins are covered with the molded resin member; and the metal frame and the signal lead pins are secured in place by the molded resin member.
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Fujino Junji
Mori Kenzo
Tanaka Hideyuki
Leydig , Voit & Mayer, Ltd.
Mitsubishi Electric Corporation
Williams Alexander O
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