Optical device, method of manufacturing the same, optical...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C257S440000

Reexamination Certificate

active

07083999

ABSTRACT:
A second substrate including a transparent substrate is bonded to a first substrate including a plurality of optical elements each of which has an optical section, with a light transmissive adhesive layer interposed, to seal the optical sections. The first substrate is then cut into the individual optical elements.

REFERENCES:
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patent: 6483030 (2002-11-01), Glenn et al.
patent: 6759723 (2004-07-01), Silverbrook
patent: 2003/0100143 (2003-05-01), Mulligan et al.
patent: 1276916 (2000-12-01), None
patent: 09-230322 (1997-09-01), None
patent: 99/18612 (1999-04-01), None
U.S. Appl. No. 10/290,062, filed Nov. 6, 2002.
U.S. Appl. No. 10/292,372, filed Nov. 12, 2002.
U.S. Appl. No. 10/308,877, filed Dec. 3, 2002.

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