Optical device heat spreader and thermal isolation apparatus

Details Optical device heat spreader and thermal isolation apparatus Optical device heat spreader and thermal isolation apparatus

1994-04-28

1996-04-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257724, 361704, 361785, 385114, H05K 720

Patent

active

055130739

ABSTRACT:
Attachment of electronics to optical devices is made by supporting the optical devices on a heat spreader card and the electronics on a separate circuit card. Each card has at least a first major surface, with an optical transducing subassembly mounted perpendicularly from the major surface of the heat spreader card. Electronics, except for transducing elements, are placed on the circuit card. The only direct attachment between the circuit card and the heat spreader card is one or more flexible cables attached to the respective major surfaces. This arrangement mechanically isolates the circuit card from the heat spreader card. The flexible cables include electrical conductors held positionally in a polyimide matrix, which provides for thermal isolation of the heat spreader card and the circuit card.

REFERENCES:
patent: 4085502 (1978-04-01), Ostman et al.
patent: 4812135 (1989-03-01), Smith
patent: 5069522 (1991-12-01), Block
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5168430 (1992-12-01), Nitsch
patent: 5251095 (1993-10-01), Miller
patent: 5280191 (1994-01-01), Chang
patent: 5353192 (1994-10-01), Nordin
IBM Technical Disclosure Bulletin, vol. 32, May 1990, (Anonymous) "Gigabit Opto-Electronic Package Using Extended MCP Substrate" pp. 129-131.

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