Optical device capable of reliably fixing a substrate to a packa

Details Optical device capable of reliably fixing a substrate to a packa Optical device capable of reliably fixing a substrate to a packa

1992-12-23

1994-03-08

Lee, John D.

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

385 88, G02B 642

Patent

active

052934411

ABSTRACT:
In an optical device comprising a substrate and a package for receiving the substrate on a bottom surface of the package, a block is fixed to an upper surface of the substrate by a low melting-point glass or a solder. The block is made of a welding material and welded to a predetermined part on a wall surface of the package. The substrate has at least one photoelectric element or optical waveguide on the upper surface. An optical fiber is fixed to the package and optically coupled to the photoelectric element or the optical waveguide through a first perforation of the package. The block may be welded to the wall surface of the package made of a welding material. The substrate may have an internal surface which defines a second perforation exposing a predetermined area of the bottom surface. The block is brought into contact with the second internal surface and the predetermined area and welded to the predetermined area.

REFERENCES:
patent: 4474429 (1984-10-01), Yoldas et al.
patent: 4548466 (1985-10-01), Evans et al.
patent: 4615031 (1986-09-01), Eales et al.
patent: 4744626 (1988-05-01), Mery
patent: 5128956 (1992-07-01), Aoki et al.
patent: 5222170 (1993-06-01), Bargar et al.

Affiliated with

Also associated with

Rating

Optical device capable of reliably fixing a substrate to a packa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical device capable of reliably fixing a substrate to a packa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical device capable of reliably fixing a substrate to a packa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-159076