Optical device assembly and its preparation using metallic bump

Details Optical device assembly and its preparation using metallic bump Optical device assembly and its preparation using metallic bump

1996-03-29

1998-03-31

Le, Que

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

250239, 257433, H01J 314

Patent

active

057341567

ABSTRACT:
An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a standoff structure extending between the optical filter and the sensor. The standoff structure is positioned at a location outside of the optically active area of the planar sensor. The standoff structure includes a standoff element, a first bonding element between the standoff and the filter, and a second bonding element between the standoff and the sensor. The two bonding elements each preferably comprise a cold-weldable indium bump. If the standoff structure, the filter, or the sensor is made of a material to which indium does not readily cold weld, a bonding pad of a material such as titanium
ickel can be inserted to facilitate the cold welding.

REFERENCES:
patent: 4943491 (1990-07-01), Norton et al.
patent: 5365088 (1994-11-01), Myrosznyk
patent: 5380669 (1995-01-01), Norton
patent: 5436492 (1995-07-01), Yamanaka

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