Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-02-21
2006-02-21
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S116000, C438S460000
Reexamination Certificate
active
07001797
ABSTRACT:
A plurality of covers each of which has a light transmitting section are attached to a substrate on which is formed a plurality of optical elements each of which has an optical section, and each of the optical sections is sealed by each of the covers. Then, the substrate is cut into individual ones of the optical elements.
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Hogan & Hartson LLP
Wilczewski M.
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