Optical device and method of manufacturing the same, optical...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C438S116000, C438S460000

Reexamination Certificate

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07001797

ABSTRACT:
A plurality of covers each of which has a light transmitting section are attached to a substrate on which is formed a plurality of optical elements each of which has an optical section, and each of the optical sections is sealed by each of the covers. Then, the substrate is cut into individual ones of the optical elements.

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