Radiant energy – Photocells; circuits and apparatus – Housings
Reexamination Certificate
1998-12-02
2001-05-29
Lee, John R. (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Housings
C385S088000, C385S094000
Reexamination Certificate
active
06239427
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an optical data link equipped with an optical module incorporating a light-emitting device or a light-receiving device therein.
2. Related Background Art
Conventionally known as an optical link of such a kind is the one configured as shown in FIG.
27
. This optical data link has a configuration in which an optical module A comprising a light-emitting device, a light-receiving device, and an electronic circuit for driving and controlling these optical devices, and so forth are assembled into an optical receptacle B for mating with an optical connector. In the optical module A, an optical device mounting section C for mounting the light-emitting device and light-receiving device, and a circuit mounting section D for mounting the electronic circuit are integrally molded by resin encapsulation.
Here, in the optical device mounting section C, the light-emitting device and the light-receiving device are separately assembled in their respective alignment sleeves E, F made of a metal, and optical axis alignment is made beforehand between these devices and optical fibers while actually establishing electric conduction therebetween. In the circuit mounting section D, an insulating substrate, in which a wiring pattern is provided, is mounted on inner leads formed on a lead frame, and an active element such as integrated circuit (IC) and a passive element such as capacitor or resistor are connected to the wiring pattern, such as to constitute the electronic circuit, while the wiring pattern is electrically connected to the inner leads and to a plurality of outer lead pins G extending from the lead frame. Then, as mentioned above, when the optical device mounting section C equipped with the alignment sleeves E, F and the circuit mounting section D are encapsulated with a resin, then the optical module A is formed. When the optical module A is assembled into the optical receptacle B on its rear end side, then the optical data link is constructed.
SUMMARY OF THE INVENTION
Since the alignment sleeves made of a metal are expensive, it has been difficult for the conventional optical data link to cut down its cost. Further, the process for manufacturing the optical module has been complicated in that the light-emitting device and light-receiving device are assembled while aligning with their alignment sleeves in terms of optical axes, electronic components such as active devices and passive devices are connected to a wiring pattern of an insulating substrate, the insulating substrate is mounted on a lead frame and provided with electric wiring, and then the individual sections are collectively encapsulated with a resin.
Also, since each of the outer lead pins G is bent at an angle greater than 90°, their installation becomes difficult when the number of pins is large or when pins are arranged in a plurality of rows. Therefore, it has been necessary to prepare separate parts, for example, such as a jig for aligning the outer lead pins G and inserting them into substrate holes, or a sub-substrate H having round pins vertically extending therefrom which is used for mounting the outer lead pins G so that the latter are installed with the aid of the sub-substrate H.
In view of such problems of the prior art, it is an object of the present invention to provide an optical data link having a configuration which can simplify its manufacturing process and enables the optical module to attach thereto easily.
In order to overcome the above-mentioned problems, the optical data link in accordance with the present invention comprises a housing; and a communication subassembly, attached to the housing, having an optical device, wherein the housing is configured such that a plurality of outer lead pins provided in the communication subassembly are secured as being positioned while penetrating through the housing at predetermined positions.
When the housing is thus configured such that the outer lead pins of the communication subassembly, which is an optical module having an optical device, penetrate through predetermined parts such as holes or grooves formed in the housing and are secured as being positioned at these parts, then the configuration and manufacturing process of the housing can be simplified, and the housing can attain a structure which allows the subassembly to be easily assembled thereto.
The communication subassembly encompasses a receiving subassembly having a light-receiving device and a transmitting subassembly having a light-emitting device.
Since such a subassembly is molded by resin encapsulation, its electronic circuit is not electrically shielded, whereby resistance to noise is desired to be improved. When the housing or a member included in the housing is employed to attain a configuration in which the subassembly is covered with conductive plating, a thin metal sheet, or the like, by contrast, then it can yield an excellent resistance to noise as an electric shield for the subassembly.
The present invention can more fully be understood from the detailed description given hereinafter and the accompanying drawings. It should be noted, however, that they are given by way of illustration only and thus are not limitative of the present invention.
Further scope of applicability of the present invention will come apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
REFERENCES:
patent: 4410469 (1993-10-01), Katagiri et al.
patent: 4539476 (1985-09-01), Donuma et al.
patent: 4911519 (1990-03-01), Burton et al.
patent: 5113466 (1992-05-01), Acarlar et al.
patent: 5127071 (1992-06-01), Go
patent: 5295214 (1994-03-01), Card et al.
patent: 5475783 (1995-12-01), Kurashima
patent: 5596665 (1997-01-01), Kurashima et al.
patent: 5661835 (1997-08-01), Kato et al.
patent: 5742480 (1998-04-01), Sawada et al.
patent: 5784513 (1998-07-01), Kuribayashi et al.
patent: 5963693 (1999-10-01), Mizue et al.
Lee John R.
McDermott & Will & Emery
Sumitomo Electric Industries Ltd.
LandOfFree
Optical data link does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical data link, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical data link will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2464248