Optical communications module and method for producing the...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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C385S049000, C385S088000

Reexamination Certificate

active

06877914

ABSTRACT:
An optical communications module in which electrical crosstalk is reduced. The term “optical communications module” represents a surface-mounting-type optical tranceiver, transmitter, or receiver module. The optical communications module has a following structure. (a) An Si substrate carries at least one signal-transmitting section comprising an LD, at least one signal-receiving section comprising a PD, or both together with other components. (b) An insulating substrate is bonded to the back face of the Si substrate. (c) A separating groove separates the Si substrate along the or each boundary line between the sections in order to prevent an AC current flowing through the Si substrate. To attain this object, the separating groove is provided from the top surface of the Si substrate to some midpoint of the insulating substrate. This structure reduces the electrical crosstalk between the signal-transmitting section and the signal-receiving section, between the signal-transmitting sections, and between the signal-receiving sections.

REFERENCES:
patent: 6614964 (2003-09-01), Kuhara et al.
patent: 6655856 (2003-12-01), Nakanishi et al.
patent: 6744074 (2004-06-01), Horie et al.
patent: 11068705 (1999-03-01), None
patent: 11202140 (1999-07-01), None
patent: 2002170984 (2002-06-01), None
R. Takahashi et al. (1999) “Packaging of optical semiconductor chips for SFF (small form factor) optical transreceiver”, Electronics Society Conference of IEICE, p133, No. C-3-28 (Prior Art cited in the Specification) and its English translation.
S. Ishii et al. (2000) “Crosstalk analysis of MT-RJ optical assembly”, Electronics Society Conference of IEICE, p352, No. SC-3-7 and its English translation.

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