Optical communication module utilizing plural semiconductor...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C372S050121

Reexamination Certificate

active

07130499

ABSTRACT:
An optical communication module comprises a plurality of monolithic semiconductor transmitter photonic integrated circuit (TxPIC) chips each having a plurality of optical signal channels approximating wavelengths on a standardized grid. Each of the channels comprises a laser source optically coupled to an electro-optic modulator. The outputs of the electro-optic modulators are coupled to inputs of an optical combiner integrated on each of the chips for combining the inputs to form a combined signal output from the chip. A second optical combiner combines the combined signal outputs from the TxPICs to form a combined optical signal group output. A booster optical amplifier is optically coupled to the second optical combiner to receive and amplify the combined optical signal group output from the second optical combiner.

REFERENCES:
patent: 5394489 (1995-02-01), Koch
patent: 5428695 (1995-06-01), Ohita
patent: 5870512 (1999-02-01), Koch et al.
patent: 5960141 (1999-09-01), Sasaki et al.
patent: 5987050 (1999-11-01), Doerr et al.
patent: 6055250 (2000-04-01), Doerr et al.
patent: 6192170 (2001-02-01), Komatsu
patent: 6236771 (2001-05-01), Aoki et al.
patent: 6240118 (2001-05-01), Doerr et al.
patent: 6271947 (2001-08-01), Iannone et al.
patent: 6275317 (2001-08-01), Doerr et al.
patent: 6304350 (2001-10-01), Doerr et al.
patent: 6392751 (2002-05-01), Koch et al.
patent: 6490044 (2002-12-01), Koch et al.
patent: 6504966 (2003-01-01), Kato et al.
patent: 6542268 (2003-04-01), Rotolo et al.
patent: 6661974 (2003-12-01), Akiyama et al.
patent: 6700517 (2004-03-01), Kellar
patent: 0636908 (1995-02-01), None
M. G. Young et al., “A 16xl WDM Transmitter with Integrated DBR Lasers and Electroabsorption Modulators”,Integrated Photonics Research, Washington, D.C., vol. 10, pp. 414-417, Mar. 22-24, 1993, Palm Springs, CA, US.
E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”,IEEE/CPMT Electronic Packing Technology Conference, 1997, Proceedings of 1997 Conference, pp. 18-28, 1STSingapore, Oct. 8-10, 1997, and IEEE in 1997, New York, NY, US.
U. Koren et al., “Photonic Integrated Circuits for Telecommunication—Present Status and Future Trends—”,Japanese Journal of Applied Physics, Extended Abstracts 22NDConference on Solid State Devices and Materials, pp. 773-775, 1990, Tokyo, JP.
Minoru Maeda et al., “Photonic Integrated Circuit Combining two GaAs Distributed Bragg Reflector laser Diodes for Generation of the Beat Signal”,Japanese Journal of Applied Physics, vol. 31(2B), pp. L183-L185, Feb. 15, 1992, Tokyo, JP.
Koji Kudo et al., “1.55-mm Wavelength-Selectable Microarray DFB-LD's with Integrated MMI Combiner, SOA, and EA-Modulator”,Optical Fiber Conference(OFC), Technical Digest Post Conference Addition, vol. 1 of 4, pp. 190-192, Mar. 7-10, 2000, Baltimore, MD, US.

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