Optical communication module and flexible printed circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S662000, C257S663000, C257S664000

Reexamination Certificate

active

07986020

ABSTRACT:
A flexible printed circuit board includes: a signal wiring pattern including: a transmission line for connecting an end of an optical device with an end of a signal generation circuit; and another transmission line for connecting another end of the optical device with another end of the signal generation circuit; a thin film resistor layer formed in a region including a region facing the signal wiring pattern so as to constitute a first microstrip line together with each of the transmission lines; a ground conductor formed in a region except a part of a region facing the thin film resistor layer within a region including a region facing the signal wiring pattern so as to constitute a second microstrip line together with each of the transmission lines; and an insulating layer formed between each two of the signal wiring pattern, the thin film resistor layer, and the ground conductor.

REFERENCES:
patent: 7010179 (2006-03-01), Hatta et al.
patent: 3084970 (2000-09-01), None
patent: 2004-193489 (2004-07-01), None
“850 nm XFP Transceiver Reference Design HFRD-19.2 (Rev.2, Oct. 2007)”, retrieved from http://pdfserv.maxim-ic.com/jp/an/AN3730J.pd on Dec. 24, 2007, by Maxim Integrated Products.

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