Optical communication module

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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C257S082000, C257S083000

Reexamination Certificate

active

06921922

ABSTRACT:
A substrate (2) is composed of laminated green sheets. The substrate (2) is provided with recesses (2f, 2g) formed on at least two locations deeper than implemented heights of ICs (4, 6) and elements (3, 5). A transmitter and a receiver are mounted in different recesses, which are individually covered with a mold resin to form a molded optical communication module (1), which operates fast and causes no optical and electrical crosstalk.

REFERENCES:
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patent: 6548895 (2003-04-01), Benavides et al.
patent: 6574399 (2003-06-01), Boudreau et al.
patent: 6627987 (2003-09-01), Glenn et al.
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patent: 6752539 (2004-06-01), Colgan et al.
patent: 6759740 (2004-07-01), Onitani et al.
patent: 6815729 (2004-11-01), Brophy et al.
patent: 6835960 (2004-12-01), Lin et al.
patent: 2003/0231840 (2003-12-01), Okada et al.

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