Optical communication between face-to-face semiconductor chips

Details Optical communication between face-to-face semiconductor chips Optical communication between face-to-face semiconductor chips

2008-05-06

2008-05-06

Connelly-Cushwa, Michelle R. (Department: 2874)

Optical waveguides

With optical coupler

Particular coupling structure

C398S156000, C398S164000

Reexamination Certificate

active

07369726

ABSTRACT:
One embodiment of the present invention provides a system that communicates between a first semiconductor die and a second semiconductor die through optical signaling. During operation, the system converts an electrical signal into an optical signal using an electrical-to-optical transducer located on a face of the first semiconductor die, wherein the first semiconductor die and the second semiconductor die are oriented face-to-face so that the optical signal generated on the first semiconductor die shines on the second semiconductor die. Upon receiving the optical signal on a face of the second semiconductor die, the system converts the optical signal into a corresponding electrical signal using an optical-to-electrical transducer located on the face of the second semiconductor die.

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