Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-01-31
2006-01-31
Eley, Timothy V. (Department: 3724)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S008000, C451S036000, C451S041000, C451S288000
Reexamination Certificate
active
06991514
ABSTRACT:
For use with a chemical mechanical polishing apparatus for polishing a semiconductor wafer having a platen, a polishing pad and a wafer carrier, an optical closed-loop control system. In one embodiment, the system includes a plurality of optical probes impacting a corresponding probe window and rigidly mountable through the platen. The system also includes a flash lamp configured to provide light to each of the plurality of optical probes and minimize an exposure time of the light onto the semiconductor wafer, a spectrograph configured to spatially image light received by each of the plurality of optical probes to a common charge-coupled device and produce real-time spectral reflectometry data therefrom. The system further includes a control subsystem configured to analyze the real-time spectral reflectometry data and determine at least one wafer state parameter therefrom, and cause the polishing to be adjusted based upon the at least one wafer state parameter.
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Kueny Andrew W.
Meloni Mark A.
Eley Timothy V.
Verity instruments, Inc.
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