Optical circuit fabrication method and device

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C385S129000

Reexamination Certificate

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07428351

ABSTRACT:
A photonic light circuit device is described that comprises a semiconductor substrate (220) and two or more optical components (226, 228, 236, 240) wherein one or more hollow core optical waveguides (230, 232, 224) are formed in the semiconductor substrate to optically link said two or more optical components. The PLC may comprise a lid portion (44) and a base portion (42). The PLC can be adapted to receive optical components (8:608) or optical components may be formed monolithically therein. Coating with a reflective layer is also described.

REFERENCES:
patent: 4068920 (1978-01-01), Bass et al.
patent: 4453803 (1984-06-01), Hidaka et al.
patent: 4973127 (1990-11-01), Cannon, Jr. et al.
patent: 5195154 (1993-03-01), Uchida
patent: 5279354 (1994-01-01), Grove
patent: 5379354 (1995-01-01), Jenkins
patent: 5410625 (1995-04-01), Jenkins et al.
patent: 5428698 (1995-06-01), Jenkins et al.
patent: 5473721 (1995-12-01), Myers et al.
patent: 5475776 (1995-12-01), Jenkins et al.
patent: 5515464 (1996-05-01), Sheem
patent: 5562838 (1996-10-01), Wojnarowski et al.
patent: 5611008 (1997-03-01), Yap
patent: 5632908 (1997-05-01), Shahid
patent: 5675603 (1997-10-01), Jenkins
patent: 5737458 (1998-04-01), Wojnarowski et al.
patent: 5917596 (1999-06-01), Jenkins et al.
patent: 6002514 (1999-12-01), Barrett et al.
patent: 6090636 (2000-07-01), Geusic et al.
patent: 6137941 (2000-10-01), Robinson
patent: 6163643 (2000-12-01), Bergmann et al.
patent: 6198857 (2001-03-01), Grasis et al.
patent: 6219470 (2001-04-01), Tu
patent: 6315462 (2001-11-01), Anthamatten et al.
patent: 6340605 (2002-01-01), Kawanishi et al.
patent: 6501869 (2002-12-01), Athale
patent: 6640021 (2003-10-01), Pogge et al.
patent: 6819825 (2004-11-01), Takeuchi et al.
patent: 6839478 (2005-01-01), Huber et al.
patent: 2002/0102059 (2002-08-01), Cho
patent: 2002/0191907 (2002-12-01), Kinoshita
patent: 2003/0035613 (2003-02-01), Huber et al.
patent: 2003/0090776 (2003-05-01), Vaganov
patent: 35 42 614 (1987-06-01), None
patent: 0 043 475 (1982-01-01), None
patent: 0 128 800 (1984-12-01), None
patent: 0 221 288 (1987-05-01), None
patent: 0 718 657 (1996-06-01), None
patent: 0 903 616 (1999-03-01), None
patent: 1 010 999 (2000-06-01), None
patent: 1010999 (2000-06-01), None
patent: 1 103 831 (2001-05-01), None
patent: 1103831 (2001-05-01), None
patent: 0 876 625 (2002-07-01), None
patent: 2 014 752 (1979-08-01), None
patent: 2 189 621 (1987-10-01), None
patent: 2 193 816 (1988-02-01), None
patent: 3025815 (1991-02-01), None
patent: 09184937 (1997-07-01), None
patent: 10-311921 (1998-11-01), None
patent: 10311921 (1998-11-01), None
patent: WO 93/25923 (1993-12-01), None
patent: 9857206 (1998-12-01), None
patent: WO 98/57206 (1998-12-01), None
patent: 9915934 (1999-04-01), None
patent: WO 99/15934 (1999-04-01), None
patent: WO 01/38921 (2001-05-01), None
patent: 0161390 (2001-08-01), None
patent: WO 01/59492 (2001-08-01), None
patent: WO 01/61390 (2001-08-01), None
patent: WO 01/75503 (2001-10-01), None
patent: WO 01/86825 (2001-11-01), None
patent: WO 02/10801 (2002-02-01), None
patent: WO 02/31551 (2002-04-01), None
T. Saida et al, “Silica-Based 2×2 Multimode Interferance Couplers with Arbitrary Power Splitting Ratio”Extended Abstracts of the 1999 International Conference on Solid State Devices and Materials, 1999, pp. 458-459.
S. Lee et al, “InGaAsP/InP Multimode Interface Splitter with Variable Splitting Ratio” Proceedings of the SPIE, vol. 3944, Jan. 2000, pp. 673-678.
R. Dangel, “Electro-Nanomechanically Actuated Integrated-Optical Interferometric Intensity Modulators and 2×2 Space Switches”Optics Communications, vol. 156, No. 1-3, Nov. 1998, pp. 63-76.
H. Takahashi, “Transmission Characteristics of Arrayed Waveguide N×N Wavelength Multiplexer”,Journal of Lightwave Technology, vol. 13, No. 3, Mar. 1995, pp. 447-455.
T. Miura et al, “Hollow Optical Waveguide for Temperature-Insensitive Photonic Integrated Circuits”J. Appl. Phys. vol. 40, 2001, pp. 688-690.
C. Rabii et al, “Optical Properties of Dual-Core Hollow Waveguides”Applied Optics, vol. 35, No. 31, Nov. 1996, pp. 6249-6252.
A.D. Norte et al, “Multiple-Layer Optical Interconnections Using Through-Wafer Hollow-Dielectric-Waveguide Vias”IEEE Photonics Technology Letters, vol. 6, No. 7, Jul. 1994, pp. 351-354.
T. Miura et al, “Propagation Characteristics of Hollow Optical Waveguide for Temperature-Insensitive Photonic Integrated Circuits”Japanese Journal of Applied Physics, vol. 40, No. 7A, Jul. 2001.
J.N. McMullin et al, “Hollow Metallic Waveguides in Silicon V-Grooves”IEEE Photonics Technology Letters, vol. 5, No. 9, Sep. 1993, pp. 1080-1082.
Patent Abstracts of Japan, vol. 0021, No. 21, Dec. 1978, (JP 53-087746).
Patent Abstracts of Japan, vol. 1997, No. 11, Nov. 1997 (JP 09184937).
Patent Abstracts of Japan, vol. 1999, No. 2, Feb. 1999 (JP 10311921).
R.M. Jenkins et al, “An Integrated Optic Approach to 10um LIDAR”Conference on Lasers and Electro-Optics in Europe, Sep. 1998, p. 389.
J. Harrington, “A Review of IR Transmitting, Hollow Waveguides”Fiber and Integrated Optics, vol. 9, No. 3, Mar. 2000, pp. 211-227.
R. Bernini et al, “Silicon Micromachined Hollow Optical Waveguides for Sensing Applications”IEEE Journal on Selected Topics in Quantum Electronics, vol. 8, No. 1, Jan./Feb. 2002, pp. 106-110.

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