Optical bond-wire interconnections and a method for...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

10649075

ABSTRACT:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

REFERENCES:
patent: 3963920 (1976-06-01), Palmer
patent: 4358676 (1982-11-01), Childs et al.
patent: 5466558 (1995-11-01), Sasaki
patent: 5668386 (1997-09-01), Makiuchi et al.
patent: 5764832 (1998-06-01), Tabuchi
patent: 5802230 (1998-09-01), Kuribayashi et al.
patent: 6187515 (2001-02-01), Tran et al.
patent: 0 816 878 (1998-01-01), None
patent: 0 846 966 (1998-06-01), None
patent: 61-121014 (1986-09-01), None
Abstract of JP 61-121014,Patent Abstracts of Japan, 1986.
Abstract of JP 03-256011,Patent Abstracts of Japan, 1991.
Balliet, L., et al., “Built-in Alignment Circuit for Fiber-Optic Silicon Optical Bench,”IBM Technical Disclosure Bulletin, vol. 24, No. 2, pp. 1158-1160 (Jul. 1981).
Ghatak, A., et al.,Introduction to Fiber Optics, Cambridge Univ. Press, pp. 221-225 (1998).
Imler, W.R., “Precision Flip-Chip Solder Bump Interconnects for Optical Packaging,”IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 6 (Dec. 1992), pp. 997-981.
Kawanobe, T., et al., “Solder Bump Fabrication by Electrochemical Method for Flip Chip Interconnection,”IEEE, Publication CH1671-7/81/0000 (1981), pp. 149-155.
Louderback, D.A., et al., “Modulation and Free-Space Link Characteristics of Monolithically Integrated Vertical-Cavity Lasers and Photodetectors with Microlenses,”IEEE Journal of Selected Topics in Quantum Electronics, vol. 5, No. 2 (1999), pp. 27-35.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Optical bond-wire interconnections and a method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical bond-wire interconnections and a method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical bond-wire interconnections and a method for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3734814

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.