Optical ball grid array inspection system

Optics: measuring and testing – By polarized light examination – With light attenuation

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Details

356372, 356364, 356369, G01B 1124

Patent

active

061340138

ABSTRACT:
A method and apparatus for inspecting a three dimensional structure, such as an electronic component, using collimated light for accurately measuring the three-dimensional structure of members protruding above the surface of the component. Collimated light illuminates the surface, and spherical or other three-dimensional structure on the surface is analyzed, using stereoscopic, holographic, Moire, or conoscopic analysis of light reflected or scattered by the structure, using an array of optical detectors in a detector plane.

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patent: 5465152 (1995-11-01), Bilodeau et al.
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patent: 5859924 (1999-01-01), Liu et al.
patent: 6028671 (2000-02-01), Svetkoff et al.
Beck et al., "3-D Solder Paste Inspection for High-Yield Ball Grid Array (BGA) Assembly".

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