Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1997-09-24
1999-09-28
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438 25, H01L 2100, H01L 2144, H01L 2148, H01L 2150
Patent
active
059602597
ABSTRACT:
A light generating apparatus includes: a submount; a semiconductor laser chip mounted on the submount; a substrate which is mount on the submount and includes an optical waveguide; and a substance having a predetermined thickness which is disposed between the semiconductor laser chip and the substrate. In an oscillation wavelength stabilizing apparatus for a light source, the light source is a semiconductor laser which includes: an active region for providing gain; and a distributed Bragg reflection (DBR) region for controlling an oscillation wavelength. The apparatus includes a control section which monotonously varies, in a first direction, a DBR current to be input to the DBR region while detecting the oscillation wavelength of an output light of the semiconductor laser so as to detect a DBR current value I.sub.o corresponding to a predetermined wave-length value, and then monotonously varies the DBR current in a second direction which is opposite the first direction beyond the detected value I.sub.o and then monotonously varies the DBR current in the first direction again to set the DBR current at the detected value I.sub.o, thereby fixing the oscillation wavelength of the semiconductor laser chip at the predetermined wavelength value.
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Kato Makoto
Kitaoka Yasuo
Mizuuchi Kiminori
Nishiuchi Ken'ichi
Uno Tomoaki
Jones Josetta I.
Matsushita Electric - Industrial Co., Ltd.
Niebling John F.
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