Optics: measuring and testing – By alignment in lateral direction
Patent
1997-08-14
1998-11-17
Kim, Robert
Optics: measuring and testing
By alignment in lateral direction
356363, 250548, G01B 902
Patent
active
058384499
ABSTRACT:
An exposure apparatus of a large-substrate single scan-exposure type by which a mask mark and a plate mark are two-dimensionally scanned in relatively narrow respective scan areas at the same time to effect highly accurate alignment. In the present invention, a first substrate and a second substrate are relatively moved in a predetermined direction with respect to a projection optical system, while an image of a pattern formed in the first substrate projectively impinges on the second substrate by way of the projection optical system. The projection optical system comprises a plurality of projection optical units arranged in a direction orthogonal to the scanning direction in order to form, on the second substrate, a same-magnification erected image of the pattern formed on the first substrate. The exposure apparatus has an alignment means for detecting a first mark formed on the first substrate and a second mark formed on the second substrate by optical scanning so as to measure a positional deviation between the first substrate and the second substrate.
REFERENCES:
patent: 4112309 (1978-09-01), Nakazawa et al.
patent: 4611122 (1986-09-01), Nakano et al.
patent: 4669883 (1987-06-01), Ina et al.
patent: 4895447 (1990-01-01), Jarisch et al.
Becker, et al., "A High Resolution Dimensional Metrology System For Masks", Integrated Circuit Metrology, Inspection, and Process Control, 1987, vol. 775, pp. 120-125.
Kato Kinya
Kato Masaki
Nara Kei
Kim Robert
Nikon Corporation
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