Optical and optoelectronic packaging and integration...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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C385S137000

Reexamination Certificate

active

06921215

ABSTRACT:
The integration, packaging and assembly of optical components, optoelectronic components and submounts using features pressed into ceramic elements. The submounts may be composed of a ceramic material and contain optical and optoelectronic components. The submounts can be movable to change the optical characteristics of modules created through the integration of optical or optoelectronic components. Such modules can have functions including optical detection, optical signal generation, optical signal branching or processing, optical switching, optical multiplexing or de-multiplexing, optical modulation or optical transmission. The disclosure also provides an example, which is not meant to be limiting, of an optical module including two or more optical components and a packaging, integration and assembly platform.

REFERENCES:
patent: 5371820 (1994-12-01), Welbourn et al.
patent: 5611008 (1997-03-01), Yap
patent: 6154591 (2000-11-01), Kershaw
patent: 6549713 (2003-04-01), Pi et al.
patent: 6606442 (2003-08-01), Korenaga et al.
patent: 6704488 (2004-03-01), Lavallee et al.

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