Optical and electrical interconnect

Optical waveguides – Integrated optical circuit

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06847747

ABSTRACT:
An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

REFERENCES:
patent: 3663194 (1972-05-01), Greenstein et al.
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4252391 (1981-02-01), Sado
patent: 4548862 (1985-10-01), Hartman
patent: 5136359 (1992-08-01), Takayama et al.
patent: 5188702 (1993-02-01), Takayama et al.
patent: 5262226 (1993-11-01), Yoshida
patent: 5312765 (1994-05-01), Kanber
patent: 5428190 (1995-06-01), Stopperan
patent: 5502889 (1996-04-01), Casson et al.
patent: 5502891 (1996-04-01), Mori et al.
patent: 5591034 (1997-01-01), Ameen et al.
patent: 5604379 (1997-02-01), Mori et al.
patent: 5679493 (1997-10-01), Kai
patent: 5681647 (1997-10-01), Caillat
patent: 5688584 (1997-11-01), Casson et al.
patent: 5727310 (1998-03-01), Casson et al.
patent: 5770305 (1998-06-01), Terasaka
patent: 5783465 (1998-07-01), Canning et al.
patent: 5879530 (1999-03-01), Caillat
patent: 6031590 (2000-02-01), Kim
patent: 6218629 (2001-04-01), Brofman et al.
patent: 6238597 (2001-05-01), Yim et al.
patent: 6574020 (2003-06-01), Ovens
patent: 20020097962 (2002-07-01), Yoshimura et al.
patent: 0487918 (1992-06-01), None
patent: WO-9001176 (1990-02-01), None
patent: WO-0060673 (2000-10-01), None
Delaney, D., et al., “Flip Chip Assembly Utilizing Anisotropic Conductive Films: A Feasibility Study”,2000 Electronic Components and Technology Conference, 641-645, (2000).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Optical and electrical interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical and electrical interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical and electrical interconnect will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3415936

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.