Optic wafer with reliefs, wafer assembly including same and...

Details Optic wafer with reliefs, wafer assembly including same and... Optic wafer with reliefs, wafer assembly including same and...

2011-04-19

2011-04-19

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S462000

Reexamination Certificate

active

07927916

ABSTRACT:
An optic wafer for assembly with an imager wafer, the optic wafer comprising a plurality of reliefs in a surface thereof coincident with street locations separating mutually adjacent optic element locations. A wafer assembly that includes the optic wafer and an imager wafer and methods of dicing a wafer assembly are also disclosed.

REFERENCES:
patent: 5516728 (1996-05-01), Degani et al.
patent: 6586831 (2003-07-01), Gooch et al.
patent: 6641381 (2003-11-01), Ball
patent: 6830990 (2004-12-01), Honer et al.
patent: 6955989 (2005-10-01), Perregaux et al.
patent: 7001797 (2006-02-01), Hashimoto
patent: 7026189 (2006-04-01), Chen et al.
patent: 7045370 (2006-05-01), Crafts et al.
patent: 2006/0110856 (2006-05-01), Chen et al.
patent: 2006/0125084 (2006-06-01), Fazzio et al.
patent: 2006/0166463 (2006-07-01), Bakke et al.
patent: 2006/0189100 (2006-08-01), Ishizuka
patent: 2006/0281227 (2006-12-01), Yang
patent: 2008/0164612 (2008-07-01), Zhuo

Affiliated with

Also associated with

Rating

Optic wafer with reliefs, wafer assembly including same and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optic wafer with reliefs, wafer assembly including same and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optic wafer with reliefs, wafer assembly including same and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2664322