Optic semiconductor module and manufacturing method

Details Optic semiconductor module and manufacturing method Optic semiconductor module and manufacturing method

2006-12-05

2006-12-05

Tran, Dzung D. (Department: 2613)

Optical communications

Optical transceiver

Single device as transmitter and receiver

C398S163000, C398S164000, C385S014000, C385S037000

Reexamination Certificate

active

07146106

ABSTRACT:
An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.

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