Opposed ball grid array mounting

Details Opposed ball grid array mounting Opposed ball grid array mounting

1997-08-20

1999-11-09

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361774, 361777, 361783, 361766, H05K 702, H01L 2312, H01L 23538, H01L 23488

Patent

active

059826339

ABSTRACT:
A printed circuit board or card includes a pair of ball grid array packages connected one over the other on opposite sides of the board or card. The packages may connect through feed-through vias so that board space on the underside of the board, populated by feed-through vias, can be utilized to provide additional functionality. In one implementation, GTL resistive terminations and decoupling capacitors may be included in the ball grid array package on the underside of the board or card.

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IBM Technical Disclosure Bulletin vol. 38 No. 01 pp. 137 and 138, Jan. 1995 .

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