Metal fusion bonding – With control means responsive to sensed condition
Reexamination Certificate
2007-08-14
2007-08-14
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
With control means responsive to sensed condition
C228S047100
Reexamination Certificate
active
10933964
ABSTRACT:
A wire feed sensor guide, used in fabrication of semiconductor packages, guides a wire W from a wire source to a wire bonding location. The wire feed sensor guide has a unitary slider1that can be manually slid into and out of a fixed portion (2or2/3). Slider1has a slot SL that guides wire W, and includes a hole S for a sensor wire SW (such as optical fiber) that senses the position of wire W within the slot. Slider1also includes an air tube hole A that transmits air to urge wire W from a first position W1toward a second position W2during a wire bonding cycle. Advantageously, the unitary nature of the slider (including its air tube hole A and sensor wire hole S) ensure that the air blowing and wire position sensing processes do not require manual adjustment. Moreover, the end of the sensor wire is substantially protected from contamination by being substantially enclosed in the slider1and exposed only inside slot SL, thus increasing reliability. Further, the insertion and extraction of slider1may be performed without tools by an individual having no specialized training or skills, thus avoiding damage to or loss of parts that occurs in conventional arrangements.
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Brady III Wade James
Johnson Jonathan
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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