Operations on a semiconductor integrated circuit having two kind

Metal working – Method of mechanical manufacture – Assembling or joining

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29577C, 29583, 29591, H01L 2190, H01L 2166

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active

045862427

ABSTRACT:
The organization of a frame portion of an integrated circuit chip to include buffers and drivers as well as a power supply for testing functional elements arranged in a "framed" portion of the chip permits smaller drivers and buffers and a lower power supply to be used during later normal operation. The frame portion may be separated completely after testing.

REFERENCES:
patent: 4240094 (1980-12-01), Mader
patent: 4488267 (1984-12-01), Harrison
An Introduction to VLSI Systems, Carver Mead and Lynn Conway, 1980, Addison-Wesley, p. 203.
IBM, Tech. Dis. Bul., vol. 15, No. 9, Feb. 1973, pp. 2935-2936, "Shift Register Tester on a Chip", by Barnard et al.
IBM, Tech. Dis. Bul., vol. 21, No. 1, Jun. 1978, pp. 5-6, "On-Chip Testing of a Single-Chip Micro Processor, by Leininger.
IBM, Tech. Dis. Bul., vol. 19, No. 2, Jul. 1976, "Read-Only Store Checking for Reliability", by Nicoletti, pp. 502-503.
IBM, Tech. Dis. Bul., vol. 17, No. 7, Dec. 1974, "Trouble Shooting LSI Circuit Units", by Howe et al, pp. 1941-1944.

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