Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-07-05
2011-07-05
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S679230, C361S679330, C361S679390, C361S719000, C165S080300, C165S104330, C165S185000
Reexamination Certificate
active
07974093
ABSTRACT:
An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins are present on the corners of the modules to mate with guide holes in the chassis to secure the module to the open frame chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules inserted into the end slots of the chassis may be exposed. The power modules are inserted into the end slots. The chassis has an inverted connection at one end slot to accommodate identical power modules at both end slots such that the heat sink area always faces a side opening in the open frame chassis.
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Levy Phil
Luskind Yuri
Moore Roger
Zeng Guang
Datskovskiy Michael V
Dickstein & Shapiro LLP
Ruggedcom Inc.
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