Open frame electronic chassis for enclosed modules

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S704000, C361S679230, C361S679330, C361S679390, C361S719000, C165S080300, C165S104330, C165S185000

Reexamination Certificate

active

07974093

ABSTRACT:
An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins are present on the corners of the modules to mate with guide holes in the chassis to secure the module to the open frame chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules inserted into the end slots of the chassis may be exposed. The power modules are inserted into the end slots. The chassis has an inverted connection at one end slot to accommodate identical power modules at both end slots such that the heat sink area always faces a side opening in the open frame chassis.

REFERENCES:
patent: 4398779 (1983-08-01), Ling
patent: 4466049 (1984-08-01), Chaney et al.
patent: 4510533 (1985-04-01), Tokuyama
patent: 4920453 (1990-04-01), Onose et al.
patent: 5436794 (1995-07-01), Clemente et al.
patent: 5828546 (1998-10-01), Tirrell et al.
patent: 5872701 (1999-02-01), Hayden et al.
patent: 5940288 (1999-08-01), Kociecki
patent: 6166919 (2000-12-01), Nicolici et al.
patent: 6175501 (2001-01-01), Bortolini et al.
patent: 6661664 (2003-12-01), Sarno et al.
patent: 6741466 (2004-05-01), Lebo
patent: 6771514 (2004-08-01), Elg
patent: 6839232 (2005-01-01), Elo et al.
patent: 7079381 (2006-07-01), Brehm et al.
patent: 7731533 (2010-06-01), Nguyen et al.
patent: 2005/0146855 (2005-07-01), Brehm et al.
patent: 2009/0122500 (2009-05-01), Metzger
patent: 2010/0097767 (2010-04-01), Jude et al.
patent: 02000232287 (2000-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Open frame electronic chassis for enclosed modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Open frame electronic chassis for enclosed modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Open frame electronic chassis for enclosed modules will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2659847

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.