One-step plasma treatment of copper foils to increase their lami

Details One-step plasma treatment of copper foils to increase their lami One-step plasma treatment of copper foils to increase their lami

1985-03-04

1986-07-01

Bueker, Richard

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Of epoxy ether

428457, 428462, 4284735, 427 41, 1562726, B05D 306, B05D 510

Patent

active

045980225

ABSTRACT:
A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.

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Shen et al., "A Review of Recent Advances in Plasma Polymerization", Plasma Polymerization, American Chemical Society, 1979, pp. 1-33.
CRC Handbook of Chem. and Physics 54th ed., CRC Press, Cleveland Ohio, p. C-234.

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