One-step encapsulation, air gap sealing and structure bonding of

Details One-step encapsulation, air gap sealing and structure bonding of One-step encapsulation, air gap sealing and structure bonding of

1992-04-08

1993-11-02

Grimley, A. T.

Recorders

Markers and/or driving means therefor

With ink supply to marker

156626, 156633, 346 11, G01D 1518

Patent

active

052587819

ABSTRACT:
A one-step process bonds a manifold to a printhead die and interconnection board located on a heat sinking substrate, encapsulates wire bonds extending from the interconnection board and the printhead die, and seals air gaps between the manifold and printhead die. A through hole is made in the heat sink substrate and communicates with a cavity defined by the manifold. During assembly, the manifold is positioned on top of the substrate containing the printhead die and the interconnection board and retained by pins. An encapsulation fluid is injected from an underside of the substrate through the through hole and into the cavity. Injection is stopped when the fluid flows nearly to the front of the printhead. The process provides encapsulation of wire bonds, sealing of any air gap between the manifold and the printhead along a front face, and enhances structural bonding of the manifold to printhead components.

REFERENCES:
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patent: 4633274 (1986-12-01), Matsuda
patent: 4639748 (1987-01-01), Drake et al.
patent: 4786357 (1988-11-01), Campanelli et al.

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